In a lead frame for an electronic component according to the present invention, a metal plate 3 is extended by a punch 5 into a hole 4 formed on a metal plate 2 and the two metal plates are connected on the inner surface of the hole 4, thereby improving a bonding strength while keeping the small size and thickness of the lead frame with a simple method.

Title
Lead frame for electronic component and method of manufacturing the same
Application Number
13/213882
Publication Number
20120133034
Application Date
August 19, 2011
Publication Date
May 31, 2012
Inventor
Akira Asada
Ryoutarou Imura
Assignee
Panasonic Corporation
IPC
H01R 43/00
H01L 23/495
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