A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and electrically interconnecting the integrated circuit device to the leads; positioning a heat spreader in non-contact proximity to the integrated circuit device such that the integrated circuit device is disposed between the leads and the heat spreader; and encapsulating the integrated device and at least a portion of the heat spreader and leads in a molding resin.

No lead package with heat spreader
Application Number
Publication Number
Application Date
August 19, 2011
Publication Date
December 15, 2011
Anang Subagio
Romarico Santos San Antonio
Mary Jean Bajacan Ramos
H01L 21/56
H01L 23/495
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