A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and electrically interconnecting the integrated circuit device to the leads; positioning a heat spreader in non-contact proximity to the integrated circuit device such that the integrated circuit device is disposed between the leads and the heat spreader; and encapsulating the integrated device and at least a portion of the heat spreader and leads in a molding resin.

Title
No lead package with heat spreader
Application Number
13/213527
Publication Number
20110304032
Application Date
August 19, 2011
Publication Date
December 15, 2011
Inventor
Anang Subagio
Romarico Santos San Antonio
Mary Jean Bajacan Ramos
IPC
H01L 21/56
H01L 23/495
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