A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

Title
Stacked microelectronic assemblies having vias extending through bond pads
Application Number
12/723039
Publication Number
20100230795
Application Date
March 12, 2010
Publication Date
September 16, 2010
Inventor
Dmitri Burshtyn
Giles Humpston
Belgacem Haba
Saratoga
CA, US
Osher Avsian
Huntersville
NC, US
Moshe Kriman
Charlotte
NC, US
Agent
LERNER DAVID et al
NJ, US
Agent
Tessera
NJ, US
Assignee
Tessera Technologies Hungary Kft
IPC
H01L 23/538
H01L 21/77
H01L 25/65
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