Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identification feature identifies the chemical mechanical polishing pad as a type of chemical mechanical polishing pad selected from a plurality of types of chemical mechanical polishing pads. Also provided is a method of making such chemical mechanical polishing pads and for using them to polish a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.

Title
Chemical Mechanical Polishing Pad Having Window With Integral Identification Feature
Application Number
12/397535
Publication Number
20100227533
Application Date
March 4, 2009
Publication Date
September 9, 2010
Inventor
Darrell String
Havre de Grace
MD, US
Ethan S Simon
Abington
PA, US
Mary Jo Kulp
Newark
DE, US
Agent
Cmp Holdings
DE, US
Rohm And Haas Electronic Materials
DE, US
IPC
B24D 03/00
B24B 01/00
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