A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Title
Microelectronic interconnect element with decreased conductor spacing
Application Number
12/459864
Publication Number
20100009554
Application Date
July 8, 2009
Publication Date
January 14, 2010
Inventor
Yoichi Kubota
Pleasanton
CA, US
Belgacem Haba
Saratoga
CA, US
Kimitaka Endo
Chang Myung Ryu
Cupertino
CA, US
Agent
LERNER DAVID et al
NJ, US
Agent
Tessera
NJ, US
Assignee
Tessera
CA, US
IPC
H01B 13/00
H01R 12/00
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