A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the leads project from this substrate. Lead frame (452) is joined to a further substrate (470) with one or more microelectronic elements (436, 404, 406) disposed between the substrates.

Title
Stacked Packaging Improvements
Application Number
11/666975
Publication Number
20090104736
Application Date
November 3, 2005
Publication Date
April 23, 2009
Inventor
Masud Beroz
San Jose
CA, US
Craig S Mitchell
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
LERNER DAVID et al
NJ, US
Agent
Tessera
NJ, US
Assignee
Tessera
CA, US
IPC
H01L 21/00
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