A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary cathode on an ring-shaped seal member for sealing a peripheral portion of the substrate; bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution; and supplying electric currents between the anode and the conductive film, and between the anode and the auxiliary cathode to carry out plating.

Title
Plating method
Application Number
11/907589
Publication Number
20090095634
Application Date
October 15, 2007
Publication Date
April 16, 2009
Inventor
Keith Kwietniak
Highland Falls
NY, US
Hariklia Deligianni
Tenafly
NJ, US
Brett C Baker O Neal
Sleepy Hollow
NY, US
Philippe Vereecken
Katsuyuki Musaka
Junji Kunisawa
Kunihito Ide
Keisuke Namiki
Natsuki Makino
Agent
Wenderoth Lind & Ponack
DC, US
IPC
C25D 05/00
C25D 05/48
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