Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.

Title
Three-dimensional microstructures and methods of formation thereof
Application Number
12/005885
Publication Number
20080191817
Application Date
December 28, 2007
Publication Date
August 14, 2008
Inventor
Shifang Zhou
Redmond
WA, US
Christopher A Nichols
Blacksburg
VA, US
David W Sherrer
Radford
VA, US
Agent
Rohm and Haas Electronic Materials
MA, US
Agent
Jonathan D Baskin
MA, US
Assignee
Rohm and Haas Electronic Materials
MA, US
IPC
H01B 13/16
H01P 11/00
H01P 03/06
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