Multilayered resist structures including bilayer and top surface imaging which utilize tuned underlayers functioning as ARCs, planarizing layers, and etch resistant hard masks whose properties such as optical, chemical and physical properties are tailored to give a multilayer resist structure exhibiting high resolution, residue free lithography and methods of preparing these materials.

Title
Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof
Application Number
11/906390
Publication Number
20080124649
Application Date
October 2, 2007
Publication Date
May 29, 2008
Inventor
John P Simons
Wappingers Falls
NY, US
Karen E Petrillo
Mahopac
NY, US
Wayne Martin Moreau
Wappingers Falls
NY, US
David R Medeiros
Dobbs Ferry
NY, US
Qinghuang Lin
Mohegan Lake
NY, US
Douglas Charles LaTulipe
Danbury
CT, US
Katherina E Babich
Chappaqua
NY, US
Marie Angelopoulos
Cortlandt Manor
NY, US
Agent
Thomas A Beck
AZ, US
IPC
G03F 07/26
G03F 07/04
View Original Source