A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

Title
Compliant terminal mountings with vented spaces and methods
Application Number
11/318815
Publication Number
20070145536
Application Date
December 27, 2005
Publication Date
June 28, 2007
Inventor
Giles Humpston
Belgacem Haba
Saratoga
CA, US
Michael J Nystrom
San Jose
CA, US
Agent
LERNER DAVID et al
NJ, US
Agent
Tessera
NJ, US
Assignee
Tessera
CA, US
IPC
H01L 21/00
H01L 23/48
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