An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface of the substrate and an electrolytic processing unit configured to perform an electrolytic process on the substrate held by the substrate holder. The electrolytic processing unit has a rotatable processing electrode, a polishing pad attached to the rotatable processing electrode, and a pressing mechanism configured to press the polishing pad against the substrate. The electrolytic processing unit also has a liquid supply mechanism configured to supply an electrolytic processing liquid between the substrate and the rotatable processing electrode, a relative movement mechanism operable to move the substrate and the rotatable processing electrode relative to each other, and a power supply configured to applying a voltage between the rotatable processing electrode and the metal film of the substrate so that the rotatable processing electrode serves as a cathode and the metal film of the substrate serves as an anode.

Title
Electrolytic processing apparatus and method
Application Number
11/202684
Publication Number
20070034526
Application Date
August 12, 2005
Publication Date
February 15, 2007
Inventor
Philippe Mark Vereecken
Matteo Flotta
Fishkill
NY, US
Brett C Baker O Neal
Sleepy Hollow
NY, US
Keith T Kwietniak
Highland Falls
NY, US
Hariklia Deligianni
Tenafly
NJ, US
John Michael Cotte
New Fairfield
CT, US
Emanuel Israel Cooper
Scarsdale
NY, US
Ray Fang
Tarrytown
NY, US
Katsuyuki Musaka
Tarrytown
NY, US
Yukio Fukunaga
Keisuke Namiki
Junji Kunisawa
Natsuki Makino
Agent
Squire Sanders & Dempsey
CA, US
IPC
B23H 03/00
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