An electrolytic processing apparatus is used to remove a metal film formed on a surface of a substrate. The electrolytic processing apparatus includes a feeding electrode 31 for feeding electricity to a metal film 6 on a substrate W, a processing electrode 32 for processing the metal film 6, a substrate carrier 11 for holding the substrate W, a first supply passage 51 for supplying a first electrolytic processing liquid, a second supply passage 52 for supplying a second electrolytic processing liquid, an insulating member 36 for electrically isolating the first electrolytic processing liquid and the second electrolytic processing liquid, a table 12 on which the feeding electrode 31, the processing electrode 32, and the insulating member 36 are disposed, and a relative movement mechanism 17 for making a relative movement between the table 12 and the substrate carrier 11.

Title
Electrolytic processing apparatus
Application Number
11/202899
Publication Number
20070034502
Application Date
August 12, 2005
Publication Date
February 15, 2007
Inventor
Katsuyuki Musaka
Tarrytown
NY, US
Yukio Fukunaga
Norio Kimura
Masayuki Kumekawa
Agent
Squire Sanders & Dempsey
CA, US
IPC
C25D 17/00
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