A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.

Title
Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates
Application Number
11/025401
Publication Number
20060138640
Application Date
December 29, 2004
Publication Date
June 29, 2006
Inventor
Belgacem Haba
Cupertino
CA, US
Masud Beroz
Livermore
CA, US
Agent
LERNER DAVID et al
NJ, US
Agent
Tessera
NJ, US
Assignee
Tessera
CA, US
IPC
H01L 23/12
H01L 21/4763
H05K 01/11
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