A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.

Title
Microelectronic packages and methods therefor
Application Number
11/140312
Publication Number
20050285246
Application Date
May 27, 2005
Publication Date
December 29, 2005
Inventor
Ilyas Mohammed
Santa Clara
CA, US
John B Riley
Dallas
TX, US
Sridhar Krishnan
San Francisco
CA, US
Yoichi Kubota
Pleasanton
CA, US
Teck Gyu Kang
San Jose
CA, US
Masud Beroz
Livermore
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
LERNER DAVID et al
NJ, US
Agent
Tessera
NJ, US
Assignee
Tessera
CA, US
IPC
H01L 23/02
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