A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

Title
Components with posts and pads
Application Number
11/166982
Publication Number
20050284658
Application Date
June 24, 2005
Publication Date
December 29, 2005
Inventor
Belgacem Haba
Saratoga
CA, US
Jae M Park
San Jose
CA, US
Teck Gyu Kang
San Jose
CA, US
Yoichi Kubota
Pleasanton
CA, US
Agent
LERNER DAVID et al
NJ, US
Agent
Tessera
NJ, US
Assignee
Tessera
CA, US
IPC
H05K 01/11
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