Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.

Title
Device package and methods for the fabrication and testing thereof
Application Number
10/941668
Publication Number
20050111797
Application Date
September 15, 2004
Publication Date
May 26, 2005
Inventor
John J Fisher
Blacksburg
VA, US
Larry J Rasnake
Blacksburg
VA, US
David W Sherrer
Radford
VA, US
Agent
Edwards & Angell
MA, US
Assignee
Rohm and Haas Electronic Materials
MA, US
IPC
G02B 06/36
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