Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.

Title
CVD diamond enhanced microprocessor cooling system
Application Number
10/466377
Publication Number
20040105237
Application Date
January 13, 2004
Publication Date
June 3, 2004
Inventor
Ronald R Petkie
Macungie
PA, US
David S Hoover
New Tripoli
PA, US
Agent
Kilpatrick Stockton
GA, US
Agent
John S Pratt Esq
GA, US
IPC
H05K 07/20
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