Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, a method comprises forming at least one conductive structure within a plurality of semiconductor substrates, said act of forming comprising first forming said at least one conductive structure to extend into a respective semiconductor substrate a distance that is less than an elevational thickness of the substrate, and second removing substrate material elevationally adjacent said one conductive structure effective to expose a surface of said one conductive structure, at least portions of one of the conductive structures having oppositely facing, exposed outer surfaces; and stacking individual substrates together such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate.

Title
Methods of forming semiconductor stacked die devices
Application Number
10/706897
Publication Number
20040097010
Application Date
November 13, 2003
Publication Date
May 20, 2004
Inventor
Belgacem Haba
Cupertino
CA, US
Agent
Lee & Hayes Pllc
WA, US
IPC
H01L 23/02
H01L 21/50
H01L 21/44
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