20030168725-A1 is referenced by 1 patents.

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.

Title
Methods of making microelectronic assemblies including folded substrates
Application Number
10/281550
Publication Number
20030168725
Application Date
October 28, 2002
Publication Date
September 11, 2003
Inventor
Vernon Solberg
Saratoga
CA, US
Belgacem Haba
Cupertino
CA, US
Young Gon Kim
Cupertino
CA, US
David Gibson
Lake Oswego
OR, US
John B Riley
Dallas
TX, US
Philip Damberg
Cupertino
CA, US
Michael Warner
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
NJ, US
Assignee
Tessera
CA, US
IPC
H05K 01/14
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