20030107105-A1 is referenced by 13 patents.

A structure and system for forming an electrical interconnection between a microelectronic device and a substrate and a method of forming the interconnection are disclosed. The interconnection includes a first electrode formed on the microelectronic device, a second electrode formed on the substrate, and an ion conductor placed between the first and second electrodes. An electrical connection between the microelectronic device and the substrate is formed by applying a bias across the first and second electrodes to form a conductive region within the ion conductor.

Title
Programmable chip-to-substrate interconnect structure and device and method of forming same
Application Number
10/255222
Publication Number
20030107105
Application Date
September 26, 2002
Publication Date
June 12, 2003
Inventor
Michael N Kozicki
Phoenix
AZ, US
Agent
One Arizona Center
AZ, US
Snell & Wilmer
AZ, US
IPC
H01L 29/00
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