20030095759-A1 is referenced by 1 patents.

An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive vias extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Title
Optical device package for flip-chip mounting
Application Number
10/013084
Publication Number
20030095759
Application Date
December 10, 2001
Publication Date
May 22, 2003
Inventor
Dan A Steinberg
Blacksburg
VA, US
Neal Ricks
Blacksburg
VA, US
David W Sherrer
Blacksburg
VA, US
Mindaugas F Dautartas
Blacksburg
VA, US
Agent
Dilworth & Barrese
NY, US
Agent
Adrian T Calderone
NY, US
IPC
G02B 06/42
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