An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensors may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.

Title
Substrate sensor
Application Number
10/288038
Publication Number
20030078484
Application Date
November 4, 2002
Publication Date
April 24, 2003
Inventor
Lyle Dean Canfield
Sylmar
CA, US
Rajiv Shah
Rancho Palos Verdes
CA, US
John C Gord
Venice
CA, US
Charles L Byers
Canyon Country
CA, US
Joseph H Schulman
Santa Clarita
CA, US
Agent
Foley & Lardner
CA, US
Assignee
Alfred E Mann Foundation for Scientific Research
IPC
A61B 05/04
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