An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Title
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component
Application Number
10/231881
Publication Number
20030047813
Application Date
August 30, 2002
Publication Date
March 13, 2003
Inventor
Stefan Wein
Christian Stumpfl
Robert Christian Hagen
Holger Worner
Josef Thumbs
Gerald Ofner
Bernd Goller
Agent
Lerner And Greenberg Pa
FL, US
IPC
H01L 23/48
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