A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solderwettable pads exposed to said surface, and an electrically conductive potential plane element having a non solderwettable surface overlying the surface of the base in proximity to the pads but spaced from said pads. The nonwettable surface of the potential plane element may include a metal such as nickel or a metal oxide. The potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element.

Title
Components with conductive solder mask layers
Application Number
9/942386
Publication Number
20020003160
Application Date
August 30, 2001
Publication Date
January 10, 2002
Inventor
Belgacem Haba
Cupertino
CA, US
Masud Beroz
Livermore
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
NJ, US
IPC
B23K 31/00
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