A processing chamber and methods for employing this processing chamber to thermally treat wafer-like objects. The chamber comprises a double walled shell, a pedestal style heater, internal passages for the transport of cooling gases and removal of exhaust gases, independently variable gas introduction patterns, and a movable door for sealing the chamber. The chamber is designed to permit in situ cooling of wafer-like objects and to provide means for precise optimization of this cooling. The methods provide for the processing of the wafer-like object in an environment where the temperature, rate of change of the temperature, composition of gases and the relative timings of changes to these variables may be controlled to achieve the desired material properties in the wafer-like object or in films contained on this wafer-like object.

Title
Thermal processing chamber for heating and cooling wafer-like objects
Application Number
9/896525
Publication Number
20010040155
Application Date
June 29, 2001
Publication Date
November 15, 2001
Inventor
Sokol Ibrani
Pleasanton
CA, US
Jack S Kasahara
Los Gatos
CA, US
Devendra Kumar
Los Altos
CA, US
Vuong P Nguyen
San Jose
CA, US
Jeffrey D Womack
Pleasanton
CA, US
Agent
Kagan Binder PLLC
MN, US
Agent
Mark W Binder Esq
MN, US
Assignee
FSI International
IPC
H05B 03/68
F27B 05/14
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