569653 is referenced by 1 patents.

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
Application Number
Publication Number
Application Date
July 9, 2002
Publication Date
January 1, 2004
Nakao Osamu
Itou Shouji
Higuchi Reiji
H05K 003/46
H05K 001/11