536926 is referenced by 1 patents.

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a flexible resin film 1 which is provided with a copper foil 2 bonded to one surface thereof and an adhesive layer 3 bonded to the other surface, opening a through hole 7 in the copper plated resin film 10 through the resin film 1 and the adhesive layer 3, filling the through hole by screen printing from the copper foil 2 with a conductive paste to form a conductive paste filler 8 having a projection 8b as projected from the adhesive layer 3.

Title
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
Application Number
091105644
Publication Number
536926
Application Date
March 22, 2002
Publication Date
June 11, 2003
Inventor
Nakao Osamu
Itou Shouji
Higuchi Reiji
Assignee
Fujikura
IPC
H05K 003/46
H05K 001/11
H05K 001/03