480636 is referenced by 1 patents.

The present invention relates to an electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment, in which the package size is nearly the same as the size of a chip, and the component has a stress absorbing layer to eliminate the necessity of a patterned flexible substrate, and can be manufactured in a large number at the same time. A method for manufacturing a semiconductor device includes the following steps: a process for forming electrodes (12) on a wafer (10); a process for forming a resin layer (14) as a stress reducing layer on the wafer (10) except for the parts where the electrodes (12) are formed; a process for forming a chrome layer (16) as the wiring on the wafer (10) including the electrodes (12) and the resin layer (14); a process for forming solder balls as external electrodes on parts of the chrome layer (16) which are formed on the resin layer (14); and a process for dicing the wafer (10) to each semiconductor chip. In the processes for forming the chrome layer (16) and for forming the solder balls, a metal thin film deposition technology used in the wafer process of semiconductor manufacturing is employed.

Title
Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
Application Number
086118038
Publication Number
480636
Application Date
December 1, 1997
Publication Date
March 21, 2002
Inventor
Hashimoto Nobuaki
Assignee
Seiko Epson
IPC
H01L 021/60