2008-235576 is referenced by 9 patents.

PROBLEM TO BE SOLVED: To provide a versatile heat dissipation structure of electronic components of improved heat dissipation characteristics, as well as a semiconductor device.SOLUTION: Relating to the heat dissipation structure of an electronic component 35 that is mounted on a wiring substrate 31, a heat insulating material 33 is provided on the upper part of the wiring substrate 31, and a first heatsink 34 is provided on the upper part of the heat insulating material 33. The electronic component 35 is placed on the upper part of the first heatsink 34.

Title
Heat dissipation structure of electronic component and semiconductor device
Application Number
2007-073100
Publication Number
2008-235576
Application Date
March 20, 2007
Publication Date
October 2, 2008
Inventor
Tsuji Kazuto
Kubota Yoshihiro
Yota Shiro
Assignee
Fujitsu
IPC
H01L 23/34