2008-121098 is referenced by 63 patents.

PROBLEM TO BE SOLVED: To provide an evaporation source with a nozzle structure where a film thickness distribution is made uniform in the width direction of a substrate, and to provide a vacuum vapor deposition system using the same.SOLUTION: A vapor produced by vaporizing or subliming a vapor deposition material by heating is discharged so as to be a belt shape from a long-length nozzle opening 2. On the other hand, in a state of being confronted with the nozzle opening 2, the substrate 3 to be vapor-deposited is carried to a direction orthogonal to the longitudinal direction of the nozzle opening in a direction of the arrow A. The discharge flow rate of the vapor per unit area in the longitudinal direction of the nozzle opening 2 is made the maximum in the part of the nozzle width direction position same as the position of the substrate edge part than the central part of the nozzle opening, and further, a plurality of partition plates 4 applying directivity to the flow of the vapor are arranged at the inside of the nozzle opening 2.

Title
Evaporation source and vacuum vapor deposition system using the same
Application Number
2006-309798
Publication Number
2008-121098
Application Date
November 16, 2006
Publication Date
May 29, 2008
Inventor
Wada Kozo
Kamikawa Susumu
Okabe Hiroko
Sato Keiichi
Kobayashi Toshiro
Oda Atsushi
Assignee
Mitsubishi Hitachi Metals Machinery
Mitsubishi Heavy
Yamagata Promotional Organization For Industrial Technology
IPC
C23C 14/24