2008-120648 is referenced by 1 patents.

PROBLEM TO BE SOLVED: To provide a semiconductor sealing glass ceramic which is friendly to environment and by which a semiconductor electronic component having ≥1,000°C heat resistance in regular use is obtained and the semiconductor electronic component.SOLUTION: The semiconductor sealing glass is for covering to seal a semiconductor and a part of a lead wire and comprises crystalline glass powder having properties that a crystal phase is deposited by the sealing and the ratio of the crystal phase is ≥50 vol.%.

Semiconductor sealing glass, semiconductor electronic component and semiconductor sealing glass ceramic
Application Number
Publication Number
Application Date
November 15, 2006
Publication Date
May 29, 2008
Mayahara Yoshio
Nippon Electric Glass
C03C 10/04
C03C 08/04
C03C 08/02
C03C 10/02