2008-120648 is referenced by 1 patents.

PROBLEM TO BE SOLVED: To provide a semiconductor sealing glass ceramic which is friendly to environment and by which a semiconductor electronic component having ≥1,000°C heat resistance in regular use is obtained and the semiconductor electronic component.SOLUTION: The semiconductor sealing glass is for covering to seal a semiconductor and a part of a lead wire and comprises crystalline glass powder having properties that a crystal phase is deposited by the sealing and the ratio of the crystal phase is ≥50 vol.%.

Title
Semiconductor sealing glass, semiconductor electronic component and semiconductor sealing glass ceramic
Application Number
2006-308703
Publication Number
2008-120648
Application Date
November 15, 2006
Publication Date
May 29, 2008
Inventor
Mayahara Yoshio
Assignee
Nippon Electric Glass
IPC
C03C 10/04
C03C 08/04
C03C 08/02
C03C 10/02