2007-013120 is referenced by 84 patents.

PROBLEM TO BE SOLVED: To provide a semiconductor device having the configuration of an antenna advantageous to miniaturization without changing the number of processes or communication distances.SOLUTION: The semiconductor device capable of achieving the items has a substrate, a tag including a thin film device provided on the substrate, a first antenna, and a second antenna. The first and the second antennae are formed in different layers isolated by an insulating film, the first antenna and the second antenna are partially connected electrically, the first antenna is formed of the same material and in the same layer as in the wiring that is connected to the thin film device, and the second antenna is formed in a layer different from the wiring that is connected to the thin film device.

Semiconductor device
Application Number
Publication Number
Application Date
May 29, 2006
Publication Date
January 18, 2007
Kobayashi Hidetomo
Semiconductor Energy Lab
H01Q 01/40
H01Q 01/24
H01Q 07/00
G06K 19/07
G06K 19/077
H01L 29/786
H01L 29/49
H01L 29/423
H01L 27/04
H01L 21/822