PROBLEM TO BE SOLVED: To provide an electronic component such as a chip from which heat can be dissipated efficiently to the outside, and to provide a semiconductor device where an electronic component is mounted on a substrate for mounting an electronic component.SOLUTION: The electronic component comprises a bump-like conductor portion 39 being connected electrically with a conductor portion formed on the major surface 60a of a substrate 60, and an auxiliary conductor portion 45 extending from the surface of the electronic component where the bump-like conductor portion is not formed toward the major surface of the substrate and having a length in the extending direction long enough to touch the major surface of the substrate when the electronic component is mounted.

Electronic component and semiconductor device
Application Number
Publication Number
Application Date
April 12, 2006
Publication Date
September 14, 2006
Ideushi Yuichi
Terui Makoto
Machida Masahiro
Noguchi Takashi
Oki Electric
H01L 23/12