PROBLEM TO BE SOLVED: To provide an electronic component such as a chip from which heat can be dissipated efficiently to the outside, and to provide a semiconductor device where an electronic component is mounted on a substrate for mounting an electronic component.SOLUTION: The electronic component comprises a bump-like conductor portion 39 being connected electrically with a conductor portion formed on the major surface 60a of a substrate 60, and an auxiliary conductor portion 45 extending from the surface of the electronic component where the bump-like conductor portion is not formed toward the major surface of the substrate and having a length in the extending direction long enough to touch the major surface of the substrate when the electronic component is mounted.

Title
Electronic component and semiconductor device
Application Number
2006-109951
Publication Number
2006-245599
Application Date
April 12, 2006
Publication Date
September 14, 2006
Inventor
Ideushi Yuichi
Terui Makoto
Machida Masahiro
Noguchi Takashi
Assignee
Oki Electric
IPC
H01L 23/12