2006-111933 is referenced by 2 patents.

PROBLEM TO BE SOLVED: To provide etching composition liquid which has more excellent restraining effect for side etching and can quickly etch exposed portion (41) in a copper thin film.SOLUTION: The etching composition liquid contains the following component (a) to component (f) and the surface tension (γ) is ≤66 mN/m. Component (a): cuplic chloride or ferric chloride component, Component (b): hydrogen chloride component, Component (c): a 2-aminobenzothiazole compound component shown by formula (I), Component (d): an ethylene glycol compound component shown by formula (II): HO(CH2CH2O)nH, Component (e): a polyamine compound or its salt component shown by formula (III): H2N(CH2CH2NH)mH, and Component (f): a glycol ether compound shown by formula (IV-a): Ra(OCH2CH2)2OH or formula (IV-b): (RbOCH2CH2)2O.

Title
Etching composition liquid
Application Number
2004-301023
Publication Number
2006-111933
Application Date
October 15, 2004
Publication Date
April 27, 2006
Inventor
Ota Koji
Assignee
Asahi Kagaku Kogyo
IPC
H05K 03/06
C23F 01/08
C23F 01/18