2006-019338 is referenced by 1 patents.

PROBLEM TO BE SOLVED: To provide a package for an electronic component which can be prevented from defective packaging and destruction, even if a semiconductor chip having a size smaller than the maximum mounting size is mounted, and to provide a semiconductor device using the same.SOLUTION: The package 1 for an electronic component contains a chip mounting section 2 for mounting a semiconductor chip in the hollow part of a metal plate and a plurality of connection electrodes 4 connected to a substrate. These connection electrodes 4 are formed on two opposite sides 5 of the rectangular metal plate and are arranged asymmetric about the perpendicular bisector 8 of the two opposite sides 5.

Title
Package for electronic component and semiconductor device using the same
Application Number
2004-193003
Publication Number
2006-019338
Application Date
June 30, 2004
Publication Date
January 19, 2006
Inventor
Tanaka Masakazu
Assignee
Nec Electronics
IPC
H01L 23/12
H01L 23/36