2006-019338 is referenced by 1 patents.

PROBLEM TO BE SOLVED: To provide a package for an electronic component which can be prevented from defective packaging and destruction, even if a semiconductor chip having a size smaller than the maximum mounting size is mounted, and to provide a semiconductor device using the same.SOLUTION: The package 1 for an electronic component contains a chip mounting section 2 for mounting a semiconductor chip in the hollow part of a metal plate and a plurality of connection electrodes 4 connected to a substrate. These connection electrodes 4 are formed on two opposite sides 5 of the rectangular metal plate and are arranged asymmetric about the perpendicular bisector 8 of the two opposite sides 5.

Package for electronic component and semiconductor device using the same
Application Number
Publication Number
Application Date
June 30, 2004
Publication Date
January 19, 2006
Tanaka Masakazu
Nec Electronics
H01L 23/12
H01L 23/36