PROBLEM TO BE SOLVED: To provide a structure for cooling electronic component and a semiconductor module which can improve reliability by relaxing stress to be applied to each portion when a plastic substrate is used, and equalizing height of solder between electronic component and cooling component without lowering of cooling property of the cooling component.SOLUTION: A semiconductor package 5 comprises the plastic substrate 51, an LSI (electronic component) 52 joined through a metal to the plastic substrate 51, and the cooling component 53 bonded through a metal to the LSI 52 in order to cool the LSI 52. Moreover, the semiconductor package 5 also comprises the plastic substrate 51, LSI 52, cooling component 53, and a cutout portion 54 (concave groove) which is extended along the junction surface 53a of the cooling component 53 toward the internal side of the cooling component 53 from the side surface thereof corresponding to the part where a stress larger than the predetermined rate for the breakdown stress is applied through the meal bonding among the junction areas of above components.

Title
Structure for cooling electronic component and semiconductor module
Application Number
2003-040857
Publication Number
2004-253522
Application Date
February 19, 2003
Publication Date
September 9, 2004
Inventor
Toyabe Yoko
Fukusono Kenji
Usui Yasuhiro
Assignee
Fujitsu
IPC
H05K 07/20
H01L 23/36