2004-151605 is referenced by 8 patents.

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having high sensitivity and high resolution and causing little reduction of the film in an unexposed part after development.SOLUTION: The positive photosensitive resin composition is characterized by containing: (A) a polyamide resin; (B) a compound which generates an acid by light; (C) a compound prepared by protecting the hydroxyl group in a specified phenolic compound with an acid-labile group which decomposes in the presence of an acid; and (D) a solvent.

Title
Positive photosensitive resin composition and semiconductor device
Application Number
2002-319226
Publication Number
2004-151605
Application Date
November 1, 2002
Publication Date
May 27, 2004
Inventor
Hirano Takashi
Banba Toshio
Makabe Hiroaki
Assignee
Sumitomo Bakelite
IPC
H01L 21/027
G03F 07/037
C08G 69/26
G03F 07/039