2004-151605 is referenced by 8 patents.

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having high sensitivity and high resolution and causing little reduction of the film in an unexposed part after development.SOLUTION: The positive photosensitive resin composition is characterized by containing: (A) a polyamide resin; (B) a compound which generates an acid by light; (C) a compound prepared by protecting the hydroxyl group in a specified phenolic compound with an acid-labile group which decomposes in the presence of an acid; and (D) a solvent.

Positive photosensitive resin composition and semiconductor device
Application Number
Publication Number
Application Date
November 1, 2002
Publication Date
May 27, 2004
Hirano Takashi
Banba Toshio
Makabe Hiroaki
Sumitomo Bakelite
H01L 21/027
G03F 07/037
C08G 69/26
G03F 07/039