2003-232886 is referenced by 8 patents.
PROBLEM TO BE SOLVED: To reduce corrosion of a metallic material, such as intergranular stress corrosion, without using other equipment for hydrogen injection and the like.SOLUTION: TiO2 in a photocatalytic n-type semiconductor is deposited on or applied to a surface of a metallic material. Exposure to high temperature water generates a thermally excited current to cause a potential drop. An increase in water temperature lowers corrosion potential. A temperature of 280°C can establish a corrosion potential causing no stress corrosion cracking to reduce corrosion of the metallic material.