2003-232886 is referenced by 8 patents.

PROBLEM TO BE SOLVED: To reduce corrosion of a metallic material, such as intergranular stress corrosion, without using other equipment for hydrogen injection and the like.SOLUTION: TiO2 in a photocatalytic n-type semiconductor is deposited on or applied to a surface of a metallic material. Exposure to high temperature water generates a thermally excited current to cause a potential drop. An increase in water temperature lowers corrosion potential. A temperature of 280°C can establish a corrosion potential causing no stress corrosion cracking to reduce corrosion of the metallic material.

Title
Corrosion reduction method for metallic material
Application Number
2002-029196
Publication Number
2003-232886
Application Date
February 6, 2002
Publication Date
August 22, 2003
Inventor
Hirano Takashi
Fukaya Yuichi
Sanhongi Mitsuru
Takamori Kenro
Suzuki Shunichi
Yotsuyanagi Tadashi
Takagi Junichi
Yamazaki Kenji
Murakami Kazuo
Yamamoto Seiji
Osato Tetsuo
Ichikawa Nagayoshi
Henmi Yukio
Okamura Masahito
Assignee
Ishikawajima Harima Heavy
Tokyo Electric Power Co The
Toshiba
IPC
G21C 13/00
G21C 03/30
G21C 03/06
C23F 11/00
G21D 01/00