PROBLEM TO BE SOLVED: To improve the reliability of the solder wettability of a conductor pin by forming uniform solder coating film on the surface of the conductor pin by providing a recessed part on the head part side of the brim part of a conductor pin, a cone shape part on the under side of the brim part and the recessed part that is connected to the recessed part of the brim part on the conductor head part. SOLUTION: A recessed part 21 that extends from the center of the brim part 12 to the part of an outer circumference is formed on the surface on the head part 11 side of the brim part 12 of a conductor pin 10. A recessed part 22 that is connected to the recessed part 21 is formed on the head part 11 of the conductor pin 10. When the conductor pin 10 is connected to the through hole 32 of the board 31 that consists a semiconductor mounting board by engaging or insertion, a gap 21a is formed between the brim part 12 and the board 31 by the recessed part 21 of the brim part 12 of the conductor pin 10 and the recessed part 22 of the head part 11, a gap 22a that is connected to the gap 21 a is formed inside the through hole 32 into which the head part 11 is inserted and through the gap 21a and the gap 22a, the solder penetrates the through hole 32. Therefore uniform solder coating on the conductor surface is obtained.

Title
Conductor pin for semiconductor mounting board
Application Number
09-045416
Publication Number
1997-199659
Application Date
February 28, 1997
Publication Date
July 31, 1997
Inventor
Takahashi Tsunehisa
Sekiya Masataka
Yatsu Hajime
Assignee
Ibiden
IPC
H01L 23/12
H01L 23/50