PURPOSE: To provide the subject material which contains specifically structured microparticles of a silicone compound having specified units and can give articles excellent in reliability such as heat shock resistance, reflow crack resistance, heat resistance, and humidity resistance. CONSTITUTION: The objective material comprises (A) an epoxy resin having at least two epoxy groups in the molecule, (B) a compound having at least two phenolic OH groups in the molecule, and (C) microparticles each having a structure composed of (i) a core of a solid silicone compound and (ii) a shell of an organic polymer, wherein component (i) is a silicone compound having units of the formula: RR'SiO2/2 (wherein R is a 6C or lower alkyl, an aryl or a substituent terminated with a carbon-carbon double bond; and R' is a 6C or lower alkyl or an aryl). It is desirable that the above units have 1-20 mol.% units comprising [RSiO3/2] and/or [SiO4/2], and component (ii) is a compound obtained by the vinyl polymerization such as an acrylic resin (copolymer) or the like.

Title
Epoxy resin molding material for sealing electronic component and semiconductor device sealed therewith
Application Number
06-244069
Publication Number
1996-134179
Application Date
October 7, 1994
Publication Date
May 28, 1996
Inventor
Michael Gekku
Runbart Deutsch
Peter Huber
Kojima Hiroki
Saito Hiroyuki
Hagiwara Shinsuke
Assignee
Wacker Chemie
Hitachi Chem
IPC
H01L 23/31
H01L 23/29
C08L 63/00
C08L 63/00
C08G 59/62
C08G 59/20