2485693-A cites 4 patents.

[en] An interdigitated structure may include at least one first metal line, at least one second metal line parallel to the at least one first metal line and separated from the at least one first metal line, and a third metal line contacting ends of the at least one first metal line and separated from the at least one second metal line. The at least one first metal line does not vertically contact any metal via and at least one second metal line may vertically contact at least one metal via. Multiple layers of interdigitated structure may be vertically stacked. Alternately, an interdigitated structure may include a plurality of first metal lines and a plurality of second metal lines, each metal line not vertically contacting any metal via. Multiple instances of interdigitated structure may be laterally replicated and adjoined, with or without rotation, and/or vertically stacked to form a capacitor.

Title
[en] Interdigitated vertical parallel capacitor
Application Number
GB20120001195
Publication Number
2485693 (A)
Application Date
August 26, 2010
Publication Date
May 23, 2012
Inventor
HE ZHONG XIANG
US
ESHUN EBENEZER E
US
COOLBAUGH DOUGLAS D
US
BOOTH ROGER A JR
US
Assignee
IBM
US
IPC
H01L 27/108
H01L 27/02
H01L 21/8242
H01L 21/768
H01L 21/3205
H01L 23/522
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