2124514-A1 is referenced by 2 patents and cites 8 patents.

The invention is directed to a method of providing a plastic substrate (1) with a metallic pattern (8) and to a plastic substrate (1) with a metallic pattern (8) obtainable by said method. The method of the invention comprises i) replicating a pattern of recesses and protrusions on a plastic substrate (1) by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate (1) with recesses and protrusions; ii) removing said stamp from said substrate; iii) - providing a layer of seed material (2) capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate at least in the recesses of said plastic substrate; - optionally providing a layer of inhibitor material on top of or below said layer of seed material (2); and - if necessary, etching excess seed material (2) and/or excess inhibitor material (3), to yield a substrate wherein said seed material (2) and/or said inhibitor material (3) remains selectively in the recesses or on the protrusions of said substrate; and thereafter iv) using said seed material (2) to initiate a metal deposition process.

Providing a plastic substrate with a metallic pattern
Application Number
EP20080156833 20080523
Publication Number
EP2124514 (A1)
Application Date
May 23, 2008
Publication Date
November 25, 2009
Tacken Roland Anthony
Furthner Francois
Peter Maria
Meinders Erwin Rinaldo
H05K 03/10
H05K 03/10
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