1951015-A1 is referenced by 2 patents.

A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.; According to the invention, therefore, it is allowed to provide a multi-layer printed wiring board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.

Title
Printed wiring board and method for manufacturing printed wiring board
Application Number
EP20060811725 20061013
Publication Number
1951015 (A1)
Application Date
October 13, 2006
Publication Date
July 30, 2008
Inventor
Okude Satoshi
JP
Suzuki Takanao
JP
Nakao Osamu
JP
Itou Shouji
JP
Okamoto Masahiro
JP
Assignee
Fujikura
JP
IPC
H01L 23/12
H05K 03/46
H01L 23/12
H05K 03/46
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