1123956-A1 is referenced by 50 patents and cites 1 patents.

There is provided an aqueous dispersion for CMP with an excellent balance between chemical etching and mechanical polishing performance. The aqueous dispersion for CMP of the invention is characterized by comprising an abrasive, water and a heteropolyacid. Another aqueous dispersion for CMP according to the invention is characterized by comprising an abrasive, water, a heteropolyacid and an organic acid. Yet another aqueous dispersion for CMP according to the invention is characterized by comprising colloidal silica with a primary particle size of 5-100 nm, water and a heteropolyacid. Preferred for the heteropolyacid is at least one type selected from among silicomolybdic acid, phosphorotungstic acid, silicotungstic acid, phosphoromolybdic acid and silicotungstomolybdic acid.; Preferred for the organic acid is at least one selected from among oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid, fumaric acid, phthalic acid, malic acid, tartaric acid and citric acid.

Title
Aqueous dispersion for chemical mechanical polishing
Application Number
EP20010102990 20010208
Publication Number
1123956 (A1)
Application Date
February 8, 2001
Publication Date
August 16, 2001
Inventor
Kawahashi Nobuo
JP
Nishimoto Kazuo
JP
Kubota Kiyonobu
JP
Hattori Masayuki
JP
Assignee
Jsr
JP
IPC
C09G 01/02
C09K 13/00
C09K 03/14
C09G 01/00
C09K 13/02
C09K 13/00
C09K 03/14
C09G 01/02
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