1030357-A1 is referenced by 8 patents and cites 5 patents.

A chip size package in which an elastomer of low elasticity for damping and absorbing a stress, as might otherwise be concentrated on bump electrodes, is formed over the principal face of a semiconductor chip and in which wires connected with bonding pads are led out to the upper face of the elastomer through through holes formed in the elastomer and are connected at their one-end portions with the bump electrodes. On the other hand, the wires, as led out to the upper face of the elastomer are formed in a curved pattern so that the stress to be concentrated on the bump electrodes may be absorbed and damped by the extension and contraction of not only the elastomer but also the wires.

Title
Semiconductor device and method for manufacturing the same
Application Number
EP19970909706 19971030
Publication Number
1030357 (A1)
Application Date
October 30, 1997
Publication Date
August 23, 2000
Inventor
Fukuda Takuya
JP
Munakata Takeshi
JP
Kubo Masaharu
JP
Kitano Makoto
JP
Eguchi Shuji
JP
Arita Junichi
JP
Anjo Ichiro
JP
Miyamoto Toshio
JP
Assignee
Hitachi
JP
IPC
H01L 23/31
H01L 23/12
H01L 21/60
H01L 23/48
H01L 23/498
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