A plurality of data storage media (71) are integrated into a microfabricated data storage system (21). The media (71) are supported by a plurality of flexures (82) that allows the media (71) to move within a plane so that data can be stored at different locations on the media (71). The flexures (82), however, significantly resist any motion of the media (71) out of the plane. Therefore, tips (52) or other devices for writing or reading to or from the media (71) can be placed a small distance from the media (71), thereby facilitating attempts to microfabricate the data storage system (21). After forming the media (71) on a microfabricated wafer (32), the wafer (32) can be bonded to another microfabricated wafer (25), and the resulting structure can thereby be sealed by a gasket (62) in order to seal the media (71) within the data storage system (21).; Preferably the bonding process to join the microfabricated wafers (25, 32) is CMOS (complementary metal-oxide semiconductor) compatible by using elements such as palladium and silicon that bond at relatively low temperatures.