0889512-A2 is referenced by 9 patents and cites 5 patents.

A conductor (112) and method for attaching a surface mount device to the conductor (112), in which solder bumps (16) formed by the method are characterized as being accurately located on the conductor (112) and having a bump height and shape that provides stress relief during thermal cycles, minimizes bridging between adjacent bumps (16), allows penetration of cleaning solutions for removing undesirable residues, and enables the penetration of mechanical bonding and encapsulation materials between the chip and its substrate (10). Such benefits are achieved by forming the conductor (112) of a nonsolderable material, on which a solderable pillar (114) is formed. The pillar (114) is selectively formed to have a shape that determines the distribution and height of the solder bump (16) on the conductor (112).

Title
Method for controlling solder bump shape and stand-off height
Application Number
EP19980201848 19980604
Publication Number
0889512 (A2)
Application Date
June 4, 1998
Publication Date
January 7, 1999
Inventor
Cornell Ralph Edward
US
Paszkiet Christine Ann
US
Coapman Christine Redder
US
Assignee
Delco Electronics
US
IPC
H01L 23/485
H01L 21/60
H01L 21/48
H05K 03/34
H05K 01/11
H01L 23/48
H01L 21/02
H05K 03/34
H05K 01/11
H01L 23/498
H01L 23/485
H01L 21/60
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