0807852-A1 is referenced by 18 patents and cites 7 patents.

A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a + b = 100 mole %; a = 60.0 - 100.0 mole %; b = 0 - 40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; ; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 mu m on a semiconductor element.

Title
Positive type photosensitive resin composition and semiconductor device using the same
Application Number
EP19970107190 19970430
Publication Number
0807852 (A1)
Application Date
April 30, 1997
Publication Date
November 19, 1997
Inventor
Takeda Toshiro
JP
Takeda Naoshige
JP
Makabe Hiroaki
JP
Banba Toshio
JP
Hirano Takashi
JP
Assignee
Sumitomo Bakelite Co
JP
IPC
G03F 07/075
G03F 07/022
G03F 07/023
G03F 07/075
G03F 07/022
G03F 07/075
G03F 07/022
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