0738561-A1 is referenced by 119 patents and cites 5 patents.

The disclosure relates to an apparatus for chemical mechanical polishing (CMP) of a wafer, comprising: a rotatable polishing patent (16) with an overlying polishing pad (18) wetted with an abrasive slurry, the platen being rotatably mounted to a chassis; a rotatable polishing head (12) for holding the wafer (14) against the polishing pad, the wafer comprising a semiconductor substrate underlying an oxide layer; and an endpoint detector. The detector comprises a laser interferometer (32) capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window (38) disposed adjacent a hole (30) formed through the platen, the window providing a pathway for the laser beam to impinge on the wafer at least during part of a period of time when the wafer overlies the window.

Title
Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations
Application Number
EP19960302176 19960328
Publication Number
0738561 (A1)
Application Date
March 28, 1996
Publication Date
October 23, 1996
Inventor
Pyatigorsky Grigory
US
Gleason Allan
US
Johansson Nils
US
Birang Manoocher
US
Assignee
Applied Materials
US
IPC
G01B 11/06
B24D 07/12
B24B 47/12
B24B 37/04
H01L 21/02
G01B 11/06
B24D 13/00
B24D 07/00
B24B 51/00
B24B 49/12
B24B 49/02
B24B 47/00
B24B 37/04
B24B 37/00
H01L 21/304
G01B 11/06
B24D 13/14
B24D 07/12
B24B 51/00
B24B 49/12
B24B 49/04
B24B 49/02
B24B 47/12
B24B 37/04
B24B 37/00
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