0459831-A2 is referenced by 3 patents and cites 4 patents.

A printed circuit board apparatus comprises a printed circuit board. The printed circuit board includes a first and a second surface and a hole portion. A printed pattern is formed on the first surface, and a parts having a lead is mounted on the second surface. The printed circuit board apparatus also includes an eyelet and plural solder entering portions. The eyelet includes a curling portion and a head portion positioned on the first and second surfaces of the printed circuit board, respectively, and a cylindrical portion, connecting the head and curling portion, inserted into the hole of the printed circuit board. A plurality of solder entering portions are formed at equal intervals on the curling portion.; From the solder entering portions, solder enters into space between the curling portion and the first surface of the printed pattern surrounding the hole of the printed circuit board and the eyelet.

Title
Method and device for mounting components on a printed circuit board.
Application Number
EP19910304965 19910531
Publication Number
0459831 (A2)
Application Date
May 31, 1991
Publication Date
December 4, 1991
Inventor
Watanabe Yoshimi
JP
Kamei Shigeru
JP
Assignee
Tokyo Shibaura Electric Co
JP
IPC
H05K 03/34
H05K 03/40
H05K 03/34
H01R 12/00
H05K 01/18
H05K 03/40
H05K 03/34
H01R 12/32
H01R 12/04
H05K 01/18
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