A printed circuit board apparatus comprises a printed circuit board. The printed circuit board includes a first and a second surface and a hole portion. A printed pattern is formed on the first surface, and a parts having a lead is mounted on the second surface. The printed circuit board apparatus also includes an eyelet and plural solder entering portions. The eyelet includes a curling portion and a head portion positioned on the first and second surfaces of the printed circuit board, respectively, and a cylindrical portion, connecting the head and curling portion, inserted into the hole of the printed circuit board. A plurality of solder entering portions are formed at equal intervals on the curling portion.; From the solder entering portions, solder enters into space between the curling portion and the first surface of the printed pattern surrounding the hole of the printed circuit board and the eyelet.